Triple Beam System(SEM, FIB, Ar Ion Beam),
FIB Processing observed in real time by SEM,
Maximum Probe Current Density : Bigger than 30A/cm2,
Maximum Probe Current : 20nA
/
SMI 3050TB
/ Circuit Edit(회로 수정), Chip Construction Analysis(Chip 구조 분석), Chip Failure Analysis(Chip 불량 분석), TEM Sample Preparation(TEM 시료 전처리)
