Metal CMP 장비는 MEMS와 반도체 공정 분야에서 3차원 구조인 5G 안테나, 인터포저, 3차원 반도체, CMOS, 각종 3차원 구조의 MEMS 센서에서 Metal을 평탄화시키는 대표적인 장비임. 이때 Si wafer 와 CMP plate를 진공상태에서 Diagram을 이용하여 균일하게 접합하는 장치를 함께 사용함으로써 wafer 두께 편차를 0.5um 이내로 조절가능함

- Workstation with independent jig speeds improved removal rates for harder materials - Assisted jig rotation for increased process control - Improved precess repeatability - Options for chemically-resistant system - Dual (metered) abrasive feed cylinders - Real-time Bluetooth Data Collection & feedback - All processes controlled via touch-screen GUI - Jig type: PP9 X 1 - Jig capacity : Up to 8" sample PP9 is suitable for multiple samples such as: 2"X 10, 3" X 4, 4" X 2 and 6" X 1- Plate speed: 160 rpm - Plate size: 560 mm (22") - Plate rotation : Counter clockwise - Carrier speed : 10 ~ 125 rpm - Equipment size: 800 x 1400 x 2030 mm- Plate flatness monitor: 0.1 micron resolution- Plate flatness ( after processing) : < 1.0 micron - Abrasive delivery: Up to 2 x 10L cylinders - Slurry flow rate : 20 ~ 500 ml/min - Material removal rates can be monitored and controlled to micron levels of accuracy - Power Supply : Single phase & Neutral & Earth. 220/240V

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