특징 High precision electron beam evaporator system is a batch-production equipment dedicated to the lift-off & conformal process for power IC, LED device & MEMS with precision line-width requirement.

구성및성능 Main Process Vacuum Chamber ◈ Inner Dimension : 450(W) X 520(H) X 400(D) - Front Door Type Vacuum Pumping Unit ◈ Turbo Molecular Pump - Capacity : 450 L/Sec ◈ Mechanical Rotary Pump - Pumping Speed : 600L/Min Substrate Heating & Rotation Unit ◈ Heating Element : 4"SiC Heating Element ◈ Max.Temperature on the wafer : 600℃ ◈ Sample Rotation Unit : 5-30 rpm Thermal & E-Beam Source with Power Supply ◈ Resistance Evaporator Unit - Include the Thermal Tungsten Boats ◈ AC Power Supply - Power Capacity : 5V, 400A(Tungsten Boats) ◈ Electron Gun Assembly - 4 Pocket of 4cc Crucible - Source 270。Deflection ◈ Electron Gun Power Supply with X-Y Sweep - Maximum Power : 6kW 활용분야 Main Process Vacuum Chamber ◈ Inner Dimension : 450(W) X 520(H) X 400(D) - Front Door Type Vacuum Pumping Unit ◈ Turbo Molecular Pump - Capacity : 450 L/Sec ◈ Mechanical Rotary Pump - Pumping Speed : 600L/Min Substrate Heating & Rotation Unit ◈ Heating Element : 4"SiC Heating Element ◈ Max.Temperature on the wafer : 600℃ ◈ Sample Rotation Unit : 5-30 rpm Thermal & E-Beam Source with Power Supply ◈ Resistance Evaporator Unit - Include the Thermal Tungsten Boats ◈ AC Power Supply - Power Capacity : 5V, 400A(Tungsten Boats) ◈ Electron Gun Assembly - 4 Pocket of 4cc Crucible - Source 270。Deflection ◈ Electron Gun Power Supply with X-Y Sweep - Maximum Power : 6kW

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